With the emergence of radio frequency identification technology, RFID packaging solutions have revolutionized the paper products processing industry. Radio frequency tags (RFID) are now transforming traditional packaging methods as equipment suppliers compete to become the first to provide comprehensive RFID labeling solutions. This innovation has led to the rapid adoption of RFID technology throughout the industry. While these advanced packaging solutions open up countless opportunities for efficiency and tracking, they also present new challenges as adoption increases across supply chains.
Most label and trademark processors are asking, “What exactly is RFID labeling?” Radio frequency technology is a method that enables the remote storage and retrieval of data, and it uses the carrier of an RF tag. Such tags contain antennas that are capable of receiving and reflecting radio waves from an RF transceiver. Depending on how the RF tag is powered, it can be categorized into two types, an active RF tag and a passive RF tag. Active RF tags contain an internal battery while the latter does not contain an internal battery. The built-in battery is capable of transmitting clear signals to a farther distance, but active RF tags are also relatively larger and more expensive than passive RF tags.
That’s where the “earthquake” occurred. RF tags are electronic devices, and they were not designed with the harsh environment of the paper-processing industry in mind. I’m not sure how familiar paper converters are with electronic components, but I can assure you that there is no place in a paper converting plant for unprotected chips. Indeed, as stated above, there are a variety of chips, some of which are more resistant to electrostatic interference, nevertheless, there are many documented cases of damage to RF chips caused by electrostatic discharge. This damage usually results in a short-term drop in product quality and, in more serious cases, in the failure of the RF chip.
1. The Problem
Static electricity is a clichéd problem in the processing of packaging and paper products. For example, processes such as slitting, printing and coating are all associated with static electricity.
Electrostatic charges are generated by materials coming into contact with and separating from each other as they pass through different stages of production and processing. When materials come into contact with and separate from each other, friction between them (tribocharging) creates a surface charge, or electrostatic charge. By definition, an electrostatic charge is a residual charge caused by an imbalance of charges. This charge is usually generated on insulating materials, such as film or coated paper, but may also be generated on conductive surfaces that are isolated from the ground. This is an important point because many material suppliers claim that their new antistatic materials protect RF chips from static charges. Unfortunately, however, their claims are not entirely correct because static charges can be transferred to conductive objects that are isolated from the ground. Once such a conductive object (e.g. an RF chip) is in close proximity to the ground, the transfer of the charge is able to cause damage to the object. Contact and separation of material surfaces
When two surfaces come into contact, a rearrangement of charges between them occurs. And when two surfaces separate, an exchange of electrons occurs. One surface will give its own electrons, then its charge equilibrium will be broken and thus be in a positively charged state, while the other surface will have an excess of electrons or be in a negatively charged state. The materials involved and the forces of attraction and pressure etc. that result from their contact and separation will have a dramatic effect on the amount of charge. To understand the charge characteristics of a material, you have to consider where the material ranks in the friction electric order. The relative position of the materials in the friction electrical sequence determines the amount and polarity of the charges generated when the materials come into contact and separate from each other. The further apart the materials are in the sequence, the greater the number of charges generated between them. Also, materials at the top of the table are more likely to trap a positive charge when they come into contact with materials lower down in the table.
Since static electricity increases gradually, it can compound the problem by increasing the charge on the material a little each time it comes into contact with another surface. This is most noticeable in processes where the material is in contact with more than one surface, as is the case with web tightening rolls in the web converting process. It is important to realize that the control of these charges should be considered as part of a plan to protect the security of RFID tags during the production process. Prone to generate a large number of charges in the typical production areas are: web transfer system – unwind device, pinch rollers, totalizers, with insulated sleeve guide rollers, corona treatment devices, gravure overprint rollers, automatic rewind device, individual packaging or on the cover device, and so on.
2. Electronics
The introduction of RF chips into the packaging/paper product converting world has changed everything. This is because these tiny circuits cannot withstand the effects of stray voltages. They can be damaged for a number of reasons, the most destructive of which is:
2.1 Damage caused by direct discharge of static electricity.
When a charged object or person comes into contact with an RF chip, some of the stored charge is transferred or discharged to the RF chip or, through the RF chip, to the ground. The charge transferred to the RF chip carries enough electricity to damage the circuitry on the chip. The transfer of energy is primarily in the form of heat, which will cause the melting of one or more layers of material inside the device.
2.2 Static electricity may also be generated when conductive objects isolated from the ground are exposed to an electrostatic field.
In these cases, the isolated conductor (the RF chip) becomes polarized in the electric field, and if this RF chip quickly comes into contact with the ground under these circumstances, it will generate a current as it seeks to balance its charge. The result is that when the electric field is removed, the RF chip generates a charge of the opposite polarity and is in a charged state, and then when it comes into contact with the ground for the second time, a direct discharge occurs.
2.3 Electromagnetic interference on the RF chip caused by the impact is also very dangerous.
The so-called electromagnetic interference is the overvoltage that we often refer to in the electronics industry. Damage to RF chips can occur if they are exposed to transient, voltage or temporary charges that exceed the insulation capacity of their circuits.
The electronics industry sector to make the failure of the analysis report shows that static electricity on the RF chip to cause indirect or destructive damage to the chance of only 10%; in 90% of the cases, it will cause potential failure, these potential failures will eventually lead to the failure of the device. I think this potential failure is very similar to a crack in glass. The glass may still work, but every time it’s pressed, the crack gets bigger until the piece of glass is finally broken. The question then becomes, when exactly does the RF tag fail? What’s more, there’s no way to fix these potential failures in the manufacturing process; you have a final test on this RF chip at your own testing station and it works fine, but when your customer tests it, it doesn’t work. At this point, the single biggest issue manufacturers face is chip integrity. Yield is not really what they need to provide their customers with a 100 percent reliable product.

China RFID UHF UCODE 9 Label Manufactuer
3. The Solution
The most active RF product in paper converting today is the pressure-sensitive label. The process has become so slow that the chips run at speeds of only 50 to 150 fpm (feet per minute) as they are transferred from the web stand to the substrate. There are some manufacturers that embed the RF chip production process into their paper converting process, or there are small label converters that transfer some pre-assembled RF chips onto printed labels. In both cases, whether the insertion equipment they use is a very sophisticated name-brand product or a process machine they assemble themselves, it can have a significant impact on static control.
To control static electricity on an RF chip, you need to use an active static eliminator that maintains a relative ionization balance and is also capable of neutralizing the charge generated during your particular (speed, material type, etc.) application. The ionization balance (positive and negative charges kept in balance) of the electrostatic precipitator is very important because offset voltages can damage some RF chips. Although there is no industry standard that specifies the voltage at which an RF chip can be protected from static electricity, many label manufacturers recommend that people keep the charge level around 500 volts. For example, chips become stronger when they are placed on a p-s label assembly line, but many insertion device manufacturers recommend that one keep static charge under control at around 1,500 volts while the label is being inserted into the label substrate. In any case, the ionization balance from a thoughtfully designed ionizer can quickly reduce the amount of static charge to a level that does not harm the RF chip.



Impinj SHORTDIPOLE Monza R6 Chip Tags
Do not use passive static eliminators (metal foil or conductive string) to protect the RF chip. Although passive static eliminators are capable of removing some static charges in some industrial environments, such ionizers are very dangerous for RF devices because they can only reduce the static charge to the critical voltage value resulting from the ionization action. The danger of using such devices is that the critical voltage value of passive static eliminators is usually higher than the voltage value that most RF chips can withstand.
Of the active static ionization products, the ones that have proven to be the most effective are the extended static bars. They are able to neutralize the static electricity on a high speed moving (2,000 to 2,500 fpm) web, and it is assembled at a very suitable distance to allow better mixing of ions, thus maintaining a better ionic balance. It also keeps the RF chip at a relatively safe distance from the high-intensity electric field immediately adjacent to the emitter. When the electrostatic bar reaches the transfer point (insertion point), it successfully neutralizes the electrostatic charge on the label stock (label printing material with adhesive and liner), paper or film. The so-called transfer point (insertion point) is where the RF chip is exposed, and at the same time, this is also the most fragile and vulnerable to electrostatic damage. Therefore, the idea of using the electrostatic rod is to ensure the electrostatic equilibrium state of this area at every moment.
The transfer (insertion) operation is very critical, because during this process, the RF chip is very likely to generate a charge due to contact or separation. One typically uses ionization equipment designed for electronic applications, ionization blowers, or air-assisted ionizers for focused areas in this regard because the ionic balance characteristics of these devices are more conducive to conductive chip sensitivity, and they also have the ability to transfer ions into tight machine spaces.
Static bars can be used at the changeover point where the RF chip is inserted to control static electricity generated during web tightening rolls or additional converting processes (e.g., die cutting). For label converters, the removal of cut material after die-cutting is also a well known area for static generation, and it typically generates static at 20,000 or 30,000 volts. It is important to control these charges to protect the RF chip and to reduce the amount of charge that accumulates on the paper roll when the web is rewound. The large amount of static charge on the paper roll is a huge threat to the RF chip assembled to the label paper for reasons already mentioned.
4. Conclusion
RF technology offers a bright future for the packaging industry, it will bring a large number of business opportunities for this industry, and, with the mass production of RF labels on wider and higher speed presses, static control becomes an increasingly important issue. As long as you can control static electricity, the future is yours.
5. Frequently Asked Questions
5.1 What are the main types of RFID tags used in packaging solutions?
There are two primary types:
Active RFID Tags: Battery-powered with longer read ranges (up to 100m), ideal for high-value asset tracking but larger and more expensive.
Passive RFID Tags: No battery, powered by reader signals. Smaller and cost-effective for item-level tagging (e.g., labels, packaging).
5.2 Why is static electricity a critical concern for RFID in packaging?
Static discharge can:
Cause immediate failure in 10% of cases
Create “potential failures” (90% of cases) where chips degrade over time
Damage circuits through heat generation (up to 30,000V in die-cutting processes)
5.3 How can packaging manufacturers protect RFID tags from static damage?
Recommended solutions:
Active ionizers: Maintain <500V charge (vs. passive eliminators that risk >1,500V)
Extended static bars: Neutralize charges at speeds up to 2,500 fpm
Process adjustments: Isolate insertion points, control web tension rolls
5.4 What industries benefit most from RFID packaging solutions?
Key applications include:
Pharma: Anti-counterfeiting with tamper-proof tags
Food/Beverage: Cold chain monitoring with temperature-sensitive labels
Luxury Goods: Jewelry tags with anti-metal designs
Logistics: Pallet tracking with rugged UHF tags
5.5 How does RFID integration impact production speeds?
Current limitations:
Label insertion: 50-150 fpm (due to static sensitivity)
High-speed workarounds: Pre-encoded tags, offline encoding stations
Future outlook: New anti-static materials may enable 500+ fpm processing
